MSSF product overview
MSSF Socket Molding Machine
MSSF Magnetically Assisted Test Socket Molding Machine
Custom molding equipment for semiconductor test sockets
The MSSF machine is designed for magnetically assisted molding of semiconductor test sockets. Machine and mold configurations can be tailored to the target socket design and production process. Projects start from 1 unit.
Share your socket, mold and process requirements.
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A closer look at
the MSSF.
The MSSF magnetically assisted test socket molding machine brings magnetic field control, temperature management and programmable pressure into a configurable molding workflow. It is intended for semiconductor test socket projects that require machine and mold settings tailored to the product design, materials and production needs.
Projects can start with one machine. The minimum order is 1 unit, with customization and delivery planned around the project.
Specifications
Product at a glance.
- Model
- MSSF
- Product type
- magnetically assisted test socket molding machine
- Application / tooling
- Project-specific semiconductor test socket molds and conductive silicone or rubber materials
- Application
- Semiconductor test socket molding
- Machine and mold
- Project-specific configuration
- Minimum order
- 1 unit
- Product family
- MSSF Socket Molding Machine ↗
Confirm tooling compatibility and operating conditions for your application with our team.
Visual details
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Meet the manufacturer.
Explore the machine, process control and project-specific configuration, followed by CarbonLink company information.
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MSSF.
Product details.
Product overview
The MSSF machine is designed for magnetically assisted molding of semiconductor test sockets and related elastomer components. The machine and mold can be specified around the intended socket structure, material and production workflow.
Magnetic and process control
The configuration combines a closed magnetic circuit, constant-current control and active cooling with multi-zone temperature control and programmable pressure and speed profiles. Automatic demagnetization after molding is designed to simplify mold removal. Final operating parameters are set for the selected machine and mold configuration.
Machine and mold configuration
Project requirements can include the socket layout, mold dimensions, cavity count, material, process recipe and production workflow. The minimum order is 1 machine. Customization and delivery are planned by project, and optional functions are selected during engineering review.
Applications and project support
The equipment is intended for semiconductor test socket manufacturers, IC test fixture makers and related packaging and test workflows. CarbonLink AI can discuss machine configuration, mold design, installation and process setup according to the project scope.
Project investment
Investment can be 40%–50% lower than comparable imported solutions, depending on the selected machine and mold configuration.
What is the MSSF designed for?
What application and tooling information is listed for the MSSF?
What should I include when asking about the MSSF?
Configuration & inquiry
Let’s check the fit
for your workflow.
Send your requirements with the model name MSSF. We can discuss the standard product and any customization needs.
Send your requirements ↗- 01Socket & tooling
Socket drawings, mold dimensions and material requirements.
- 02Process & integration
Forming process, equipment interfaces and required quantity.
- 03Quantity & customization
Required quantity, equipment constraints and branding requirements.